Re: [AMBER] no bonds formed between AA and non-standard residue

From: David A Case <david.case.rutgers.edu>
Date: Wed, 19 Feb 2020 08:55:28 -0500

On Wed, Feb 19, 2020, Vaibhav Dixit wrote:

>I removed the TER card between residues 420 and 421, then used bond command
>as shown below.

>This has bonded the non-std residue CYS-HEM with main chain as expected.
>tleap adds amide bond between 420 and 421, which I want to delete using
>parmed deletebond command.

>> deleteBond :420,421
>Bad command deleteBond:

The deleteBond command requires two masks; type "help deleteBond" to see
more info.

...dac


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Received on Wed Feb 19 2020 - 06:00:03 PST
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